China Wafer Level CSP Co., Ltd. 603005.SS
Dividend historical
Dividend payout ratio
0.58 %
Dividend split
| Date | Split |
|---|---|
| 2022/05/20 | 13 / 10 |
| 2021/06/15 | 11 / 10 |
| 2020/05/19 | 6 / 5 |
Dividend payout ratio
Dividend split
| Date | Split |
|---|---|
| 2022/05/20 | 13 / 10 |
| 2021/06/15 | 11 / 10 |
| 2020/05/19 | 6 / 5 |